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Variable Capacitance Diodes
MA27331
Silicon epitaxial planar type
Unit: mm
For VCO of a UHF radio Features
* Good linearity of C - V curve * Small series resistance rD * SSS-Mini type package, optimum for downsizing of equipment
0.27+0.05 -0.02 2
0.10+0.05 -0.02
1.000.05
1.400.05
1 0.600.05 5
Absolute Maximum Ratings Ta = 25C
Parameter Reverse voltage Junction temperature Storage temperature Symbol VR Tj Tstg Rating 12 125 -55 to +125 Unit V C C
0.15 min.
5
0 to 0.01
1: Anode 2: Cathode SSSMini2-F1 Package
Marking Symbol: A
Electrical Characteristics Ta = 25C 3C
Parameter Reverse current Diode capacitance Symbol IR CD(1V) CD(2V) CD(4V) CD(10V) Capacitance ratio Series resistance * CD(1V) /CD(4V) CD(2V) /CD(10V) rD CD = 9 pF, f = 470 MHz VR = 12 V VR = 1 V, f = 1 MHz VR = 2 V, f = 1 MHz VR = 4 V, f = 1 MHz VR = 10 V, f = 1 MHz 17.0 14.0 10.0 5.5 1.53 2.25 6.0 1.60 2.50 0.18 15.0 Conditions Min Typ Max 10 20.0 16.0 12.4 6.5 1.83 2.75 0.22 Unit nA pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. Absolute frequency of input and output is 470 MHz. 3. *: Measuring instrument; YHP MODEL 4191A RF IMPEDANCE ANALYZER
0.15 max.
0.520.03
0.15 min.
Publication date: March 2004
SKD00061BED
1
MA27331
IF VF
120 25C 100 10 2
CD VR
f = 1 MHz Ta = 25C
1.028 f = 1 MHz
CD Ta
VR = 1 V
Diode capacitance CD (pF)
1.020 2V
Forward current IF (mA)
CD (Ta) CD (Ta = 25C)
80 Ta = 60C
4V 1.012 10 V 1.004
60
10
40
-25C
0.996
20
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1
0.988
0
10
20
0
20
40
60
80
100
Forward voltage VF (V)
Reverse voltage VR (V)
Ambient temperature Ta (C)
IR T a
10 VR = 12 V
Reverse current IR (nA)
1
10 -1
10 -2
0
40
80
120
Ambient temperature Ta (C)
2
SKD00061BED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP

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